No-Clean Reflow Process Implementation
نویسندگان
چکیده
ne of the corporate goals at AT&T is to eliminate chloroflurocarbons (CFCs) from its manufacturing operations by the end of 1994. Many alternatives have been implemented to meet this objective, including noclean wave soldering using low-solids flux, aqueous cleaning of water-soluble flux, aqueous cleaning with saponifiers and semiaqueous (terpene) cleaning. Part 1 of this article describes the development of a noclean reflow soldering process using low-residue solder paste (LRSP).
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